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ESSEMTEC SMART-SIZED HIGH SPEED DISPENSER
The Spider – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
Technical Parameters
Maximum dispensing speed Piezo Jet Valve: > 720’000 dots/h Dispensing mode Dot, line, curve, interpolated 3D contour Placement XY dots 40 μm (3σ) Positioning Z axis 20 μm (3σ) PCB dimensions 50 x 50 mm bis zu 406 x 305 mm (2 x 2” up to 16 x 12”) Machine footprint 880 x 1090 mm (34.7 x 43”)